LinkStation

Tailored for high-intensity computing scenarios like AI computing, scientific innovation, and industrial digitalization, LinkStation centers on robust heat dissipation and comprehensive compatibility, delivering an efficient, stable computing solution.
LinkStation uses a proprietary dual-zone isolated cooling architecture that places high-power components and hard drives in two separate thermal zones, physically isolating heat sources to eliminate thermal crosstalk. It also supports dual liquid cooling for both the CPU and GPU, breaking the limitations of traditional air cooling. This delivers a 40% boost in heat dissipation compared to purely air-cooled models of the same size and provides reliable cooling performance even under a load of 2000 W. As a result, the product enables 24/7 continuous, stable operation, accommodating high-intensity tasks such as AI training, complex rendering, and industrial simulation. Moreover, while ensuring the unrestricted release of its powerful, peak performance, dual liquid cooling minimizes the noise associated with traditional air cooling, keeping overall noise at or below 56 dB to create a quieter environment for focused working.
LinkStation is compatible with mainstream platforms (Intel/AMD/Huawei Ascend/Hygon, etc.) and architectures (X86/ARM), enabling seamless adaptation from general-purpose computing to China’s IT innovation. A spacious 50 L modular space accommodates an independent air duct for hard drives, allows for dual-GPU expansion, and supports versatile CPU/GPU combinations, leaving ample room for future expansion, upgrading, and migration. In addition, the product utilizes 1.2 mm thickened SGCC steel paired with reinforcement ribs and reinforced localized structures to greatly boost impact resistance and rigidity; a proprietary X/Y/Z adjustable bracket provides robust support to effectively bear the weight of a heavy GPU, lowering the risk of structural damage to the GPU and the motherboard slot during long-term operation.